FREE WEBINAR
FUTURE ROBOT DESIGNS –
New Connectors Improve Board Density,
Thermal and Vibration Challenges
About The Webinar
Webinar Will Cover:
• Managing the circuit board layout when adding more intelligence and
functionality to your system
• Miniaturizing high-speed interconnect with controlled impedance
• Why higher operating temperature affects component specification
• Improving performance in high vibration circuit b oar d applications
Applications Include:
• Mobile robotic vehicles such as AGV/AMR
• SOM, SBC, Main to Sub PCB board-to-board multiple connections
• LiDAR, Radar, HMI, Camera, Sonar, Encoder, and sensitive signals for EMC
• Power distribution modules
Connector Types Discussed:
• FunctionMax Floating board-to-board connectors
• EnerBee Wire-to-board and wire-to-wire connectors
• ix Industrial - New IEC small form factor Ethernet interface
William MacKillop
Interconnect Technology & Technical Support Manager – Bachelor of Science, Electrical Engineering from Northeastern University, Boston. 30+ years experience in the Electronics field 20+ years experience in electrical connectors. Various technical articles published and patents issued. Hirose Electric, 9 years.
Joe Kawada
Industrial Segment Manager – Bachelor of Arts in Human Kinetics from The University of British Columbia. Hirose Electric, 6 years experience including industrial marketing strategy implementation, product planning & development.
Chris Lattig
Business Development Manager – Bachelor of Arts in Physics, Gettysburg College. 25 years of connector experience including product management, new product development, application engineering and customer support.