About The Webinar

Webinar Will Cover:
•     Managing the circuit board layout when adding more intelligence and  
​​​​​​​        functionality to your system
•     Miniaturizing high-speed interconnect with controlled impedance
•     Why higher operating temperature affects component specification
•     Improving performance in high vibration circuit b oar d applications

Applications Include: 
•     Mobile robotic vehicles such as AGV/AMR
•     SOM, SBC, Main to Sub PCB board-to-board multiple connections
•     LiDAR, Radar, HMI, Camera, Sonar, Encoder, and sensitive signals for EMC
•     Power distribution modules
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​​​​​​​Connector Types Discussed:
•     FunctionMax Floating board-to-board connectors
•     EnerBee Wire-to-board and wire-to-wire connectors
•     ix Industrial - New IEC small form factor Ethernet interface